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| PCA9901 One wire single LED driver Rev. 01 -- 3 December 2009 Product data sheet 1. General description The PCA9901 is a 20 mA current source for a single LED that allows stand-alone blinking of a predefined pattern to off-load the microcontroller and save battery power. Programming of the device is done through a training sequence: the host controller sends the LED lighting sequence and the PCA9901 memorizes it. Once the sequence has been memorized, the PCA9901 can be programmed to send it once or in a loop until the host controller requests the sequence to be stopped. Commands and blinking sequence are sent through a uni-directional one-wire interface. Commands include: Training Start, Training End, Execute Sequence (once or in loop until a Stop Command is requested) and Reset. A blinking sequence includes up to 3 different blinking patterns, each defined by its ON and OFF timings. A bypass mode allows the training sequence to be ignored and the LED output to follow the one-wire interface Logic state to directly control the LED from the microcontroller. An external resistor sets the maximum current that flows in the LED, which can be set between 1 mA and 20 mA. The PCA9901 operates from a 2.7 V to 5.5 V power supply. 2. Features 1 wire interface to control the device Stand-alone blinking capability while training the sequence to blink Sequence includes up to 3 blinking elements 12-bit (4096 steps) LED ON and OFF timings for each blinking element: ON timing is captured between 1 ms and 255 ms OFF timing is captured between 20 ms and 5.1 s 1.8 V compliant one-wire logic interface Training Start, Training End, Run-Once, Run, Stop and Reset commands High side current controlled LED driver with 1 mA to 20 mA max current in the LED set by an external resistor. 5 mA drive capability when no external resistor is connected 110 mV max dropout voltage driver at 20 mA Fully internal oscillator for sequence training, LED timing, Command and Sequencing Controls Short circuit and thermal protection 2.7 V to 5.5 V power supply Very low quiescent current: < 0.75 A NXP Semiconductors PCA9901 One wire single LED driver ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 Latch-up testing is done to JEDEC Standard JESD78, which exceeds 100 mA Temperature range: -40 C to +85 C Packages offered: TSSOP8, XSON8U, WLCSP6 3. Applications Cellular telephones Stand-alone status indicator 4. Ordering information Table 1. Ordering information Package Name PCA9901DP PCA9901GD PCA9901UK TSSOP8 Description plastic thin shrink small outline package; 8 leads; body width 3 mm Version SOT505-1 SOT996-2 Type number XSON8U plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm WLCSP6 wafer level chip-size package; 6 bumps; 1.0 x 1.2 x 0.6 mm 4.1 Ordering options Table 2. Ordering options Topside mark 9901 P01 P01 Temperature range -40 C to +85 C -40 C to +85 C -40 C to +85 C Type number PCA9901DP PCA9901GD PCA9901UK 5. Marking 002aae751 Top view. Dot is bump A1 indicator. Fig 1. PCA9901UK (WLCSP6) marking PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 2 of 27 NXP Semiconductors PCA9901 One wire single LED driver 6. Block diagram VDD PCA9901 short/thermal disable CTRL INPUT FILTER DIGITAL INTERFACE DECODER control signals sequence enable OSCILLATOR clock ON AND OFF COUNTERS REGISTERS BAND GAP Vbg(int) VDD PATTERN SEQUENCER LED CURRENT CONTROL 400 : 1 RATIO SHORT-CIRCUIT AND THERMAL PROTECTION LEDOUT 002aac602 GND ISET Fig 2. Block diagram of PCA9901 PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 3 of 27 NXP Semiconductors PCA9901 One wire single LED driver 7. Pinning information 7.1 Pinning GND LEDOUT GND LEDOUT n.c. ISET 1 2 3 4 002aac855 1 2 8 7 VDD TEST1 n.c. CTRL 8 7 VDD TEST1 n.c. CTRL PCA9901GD n.c. ISET 3 4 6 5 PCA9901DP 6 5 002aac856 Transparent top view Fig 3. Pin configuration for TSSOP8 ball A1 index area Fig 4. Pin configuration for XSON8U PCA9901UK A1 B1 C1 A2 B2 C2 GND LEDOUT ISET 002aac604 VDD TEST1 CTRL Transparent top view Fig 5. Pin configuration for WLCSP6 7.2 Pin description Table 3. Symbol Pin description Pin WLCSP6 TSSOP8, XSON8U VDD TEST1 CTRL GND ISET n.c. A1 B1 C1 A2 C2 8 7 5 1 2 4 3, 6 I I I I O I power supply for test purposes only; must be connected to GND digital interface ground supply LED output (anode LED) current set resistor input; resistor to ground not connected Type Description LEDOUT B2 PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 4 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8. Functional description Refer to Figure 2 "Block diagram of PCA9901". 8.1 Digital interface overview - CTRL pin The digital interface is a simple one-wire uni-directional interface allowing the host controller device to: * send the lighting sequence to the LEDOUT pin and request the PCA9901 to capture and memorize it at the same time * send the specific commands to execute the captured and memorized sequence later * reset the PCA9901 to a known state at any time. The lighting sequence to be captured by the PCA9901 contains the actual LED ON (CTRL = 1) and LED OFF (CTRL = 0) timings. A sequence includes up to 3 different patterns, each one containing one ON and one OFF value. Up to 3 LED ON and 3 LED OFF times can then be memorized by the PCA9901. Commands are specific events that tell the PCA9901 what action needs to be performed. The different commands are: TRAINING START: Beginning of the training sequence. Upon reception of this command, the PCA9901 starts capturing the lighting sequence. TRAINING END: End of the training sequence. Upon reception of this command, the capture stops, and the sequence is stored in the corresponding registers. The PCA9901 goes to Shutdown mode. RUN ONCE: The sequence that has been memorized is executed once and then the PCA9901 goes to Shutdown mode. If no sequence has been previously captured, the PCA9901 goes to Shutdown mode. RUN: The sequence that has been memorized is executed until a STOP Command occurs. STOP: The LED output is switched off at the end of the current LED ON time and the PCA9901 goes to Shutdown mode. RESET: The PCA9901 is reset and all the internal registers default to zeroes. The PCA9901 goes to Shutdown mode. The PCA9901 decodes the commands using a 1.5 ms window from the first LOW to HIGH transition that occurs on the CTRL pin. The following command or the data following a command must then be issued at least 1.5 ms after. At the end of the 1.5 ms window: * The PCA9901 is fully operational (in the case the command is issued while the PCA9901 was in Shutdown mode) * The command has been successfully decoded and the PCA9901 is ready for the next message from the host controller (which will start at the next LOW to HIGH transition on the CTRL pin), or is ready to execute the required command. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 5 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8.2 Command descriptions 8.2.1 TRAINING START command 2 pulses sent to the PCA9901 in less than 1.5 ms causes the PCA9901 to enter the Training mode. The PCA9901 leaves the Shutdown mode as soon as the 1st rising edge is detected, resets its registers to zeroes and is ready for sequence capture within the 1.5 ms. The next assertion of the CTRL pin (LOW to HIGH transition) starts the first LED ON period capture. CTRL cannot be asserted in less than 1.5 ms after the TRAINING START command has been issued. 8.2.2 TRAINING END command 3 pulses sent to the PCA9901 in less than 1.5 ms causes the PCA9901 to leave the Training mode. The PCA9901 ends the last LED OFF period capture when the TRAINING END command occurs. The PCA9901 goes to Shutdown mode. 8.2.3 RUN ONCE command 4 pulses sent to the PCA9901 in less than 1.5 ms causes the device to enter the RUN ONCE mode and wait for a `synchronization' rising edge on CTRL. When a rising edge on CTRL is detected, the sequence that has been previously captured is run once. If no sequence has been captured it will go into Shutdown mode. Once the sequence has been run, the PCA9901 goes to Shutdown mode. Remark: CTRL line may stay either HIGH or LOW after the `synchronization' edge. 8.2.4 RUN command A LOW to HIGH transition followed by a HIGH state longer than 1.5 ms causes the sequence that has been previously captured to be executed in loop. The CTRL pin stays HIGH as long as the sequence is executed. If no sequence has been captured it will go into Shutdown mode. 8.2.5 STOP command A HIGH to LOW transition when the PCA9901 is in the RUN mode causes the sequence that is running to stop: * Immediately, if the transition occurred during the LED OFF time * After finishing the execution of the current LED ON cycle if the transition occurred during the LED ON time. Once the sequence has been stopped, the PCA9901 goes to Shutdown mode. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 6 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8.2.6 RESET command A single pulse sent to the PCA9901 in less than 1.5 ms causes the PCA9901 to go to Shutdown mode and to reset its registers to zeroes. 8.3 State machine power-up; registers reset to zeroes no patterns memorized RUN or RUN ONCE Shutdown mode RESET PCA9901 up and running RUN ONCE TRAINING START PCA9901 up and running; registers reset to zeroes RUN time-out detected during training sequence training sequence; LEDOUT follows CTRL state sequence sent by host controller TRAINING END PCA9901 up and running TRAINING END sequence memorized; LEDOUT off PCA9901 up and running sequence is sent once to LEDOUT(1) LEDOUT follows CTRL state: LEDOUT = ON when CRTL = HIGH; LEDOUT = OFF when CTRL = LOW sequence is sent (loop) to LEDOUT(1) STOP Bypass mode when registers still at zeroes RESET registers reset to zeroes 002aac605 (1) PCA9901 goes directly to Shutdown mode if a training sequence has not been previously performed. Fig 6. State machine of the PCA9901 PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 7 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8.4 Lighting training sequence Training sequence starts after a TRAINING START command has been issued by the host controller and ends after a TRAINING END command has been issued. The LED ON timing is provided when CTRL is HIGH and the LED OFF timing is provided when CTRL is LOW. LEDOUT follows CTRL Logic state during the Training sequence: The LED is ON when CTRL = HIGH, and the LED is OFF when CTRL = LOW. The sequence is as follows: Pattern 1 ON - Pattern 1 OFF - Pattern 2 ON - Pattern 2 OFF - Pattern 3 ON - Pattern 3 OFF A sequence composed by only 1 or 2 patterns can also be stored by issuing the TRAINING END command after either the 1st or the 2nd pattern. Non-programmed registers during the training sequence remain programmed with zeroes; when the state machine encounters a Zero ON time register, it loops to the beginning of the sequence. * LED ON timing: 1 ms step with a 12-bit resolution - Time between 1 ms and at least 255 ms. An ON time higher than 255 ms causes the ON counter to saturate at max value (0xFF). * LED OFF timing: 20 ms step with a 12-bit resolution - Time between at least 20 ms and 5.1 s. An OFF time higher than 5.1 s causes the OFF counter to saturate at max value (0xFF). ON and OFF timings are stored on the 8-bit registers. The registers are reset to zeroes when the host controller sends a TRAINING START or RESET command. LED ON TRAINING START 1_ON 1_OFF Pattern 1 LED OFF LED ON LED OFF 2_ON 2_OFF Pattern 2 LED ON LED OFF TRAINING END 3_ON 3_OFF Pattern 3 sequence LEDOUT pin follows CTRL state dring the sequence capture 002aac606 1_ON, 2_ON and 3_ON timings: between 1 ms and at least 255 ms (4096 steps). 2_OFF, 2_OFF and 3_OFF timings: between at least 20 ms and 5.1 s (4096 steps). Fig 7. Lighting sequence capture PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 8 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8.5 TRAINING START and TRAINING END commands waveforms last LED OFF timing TRAINING START command first LED ON timing TRAINING END command 1.5 ms minimum Training sequence PCA9901 leaves Shutdown mode and is ready for capture within 1.5 ms (max). All registers are set to zeroes. 1.5 ms minimum PCA9901 goes to Shutdown mode 002aac607 Fig 8. TRAINING START and TRAINING END commands 8.6 RUN ONCE, RUN, STOP and RESET commands waveforms programmed sequence runs once RUN ONCE command LEDOUT = OFF PCA9901 goes to Shutdown mode 1.5 ms minimum STOP command RUN command programmed sequence runs in loop PCA9901 goes to Shutdown mode immediately if LED is OFF (counting LED OFF time). or PCA9901 goes to Shutdown mode once the current LED ON time has been performed. 1.5 ms minimum LED on RESET command PCA9901 leaves Shutdown mode 1.5 ms minimum PCA9901 leaves Shutdown mode All registers set to zeroes; PCA9901 goes to Shutdown mode. 002aac608 Fig 9. RUN ONCE, RUN, STOP and RESET commands 8.7 Bypass mode A Bypass mode allows the PCA9901 LEDOUT pin to be directly driven by the CTRL logic state. A TRAINING START command followed immediately by a TRAINING END command enters the Bypass mode. Once the TRAINING END command has been issued, the LEDOUT output follows the CTRL logic state (LED ON when CTRL = HIGH, LED OFF when CTRL = 0). Sending a RESET command exits the Bypass mode. The Bypass mode allows the microcontroller to directly control the LED and blink it or dim it. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 9 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8.8 Time-out The time-out circuitry allows the PCA9901 to be safely set back to the Shutdown mode when a communication problem occurs between the host controller and the PCA9901. 8.8.1 CTRL LOW too long after receiving a TRAINING START command The PCA9901 is waiting for the first LED ON timing. 1. Once the TRAINING START command has been decoded (end of the 1.5 ms window), a time-out counter starts counting as long as CTRL stays LOW. 2. The time-out counter counts until it reaches the maximum allowed ON value. The maximum allowed ON time is greater than or equal to 255 ms. Remark: If CTRL goes HIGH before reaching the maximum counter value, the time-out counter is reset and the PCA9901 starts counting the LED ON timing or decoding the command that has been issued. 3. If the maximum time-out value is reached, the training sequence is automatically terminated and the PCA9901 goes to Shutdown mode. Remark: When the time-out occurs and the PCA9901 goes to Shutdown mode, the registers are still programmed with zeroes. 8.8.2 CTRL HIGH too long during the training sequence The PCA9901 is counting the ON timing and reaches the counter maximum value (0xFF). If CTRL does not go LOW when reaching the max value: 1. The PCA9901 switches off the LEDOUT pin. 2. Maximum ON count is stored in the corresponding ON register. 3. A time-out counter starts counting until it reaches the maximum allowed OFF value. The maximum allowed OFF time is greater than or equal to 5.11 seconds. 4. When the maximum time-out counter value is reached, maximum OFF count is stored in the corresponding OFF register. Remark: If CTRL goes LOW before reaching the maximum counter value, the time-out counter is reset and the PCA9901 starts counting the LED OFF timing. 5. If the maximum time-out value is reached, the training sequence is automatically terminated and the PCA9901 goes to Shutdown mode. 8.8.3 CTRL LOW too long during the training sequence The PCA9901 is counting the OFF timing and reaches the counter maximum value (0xFF). If CTRL does not go HIGH when reaching the maximum value: 1. Maximum OFF count is stored in the corresponding OFF register. 2. A time-out counter starts counting until it reaches the maximum allowed OFF value. The maximum allowed OFF time is greater than or equal to 5.11 seconds. 3. When the maximum time-out counter value is reached, the training sequence is automatically terminated and the PCA9901 goes to Shutdown mode. Remark: If CTRL goes HIGH before reaching the maximum counter value, the time-out counter is reset and the PCA9901 starts counting the LED ON timing or decoding the command that has been issued. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 10 of 27 NXP Semiconductors PCA9901 One wire single LED driver 8.8.4 `Synchronization' signal not generated after RUN ONCE command The PCA9901 is waiting for the `Synchronization' signal (rising edge of CTRL) after a RUN ONCE command has been issued. 1. Once the RUN ONCE command has been decoded (end of the 1.5 ms window), a time-out counter starts counting as long as CTRL stays LOW. 2. The time-out counter counts until it reaches the maximum allowed ON value. The maximum allowed ON time is greater than or equal to 255 ms. Remark: If CTRL goes HIGH before reaching the maximum counter value, the time-out counter is reset and the PCA9901 runs the sequence once. 3. If the maximum time-out value is reached, the RUN ONCE command is automatically aborted and the PCA9901 goes to Shutdown mode. 8.9 Current source generation The LED output contains a constant current driver that will source a current that is determined by an external resistor connected between ISET pin and GND. The current can be set using the following formula: ( 1.23 x 400 ) I O = ----------------------------R ext (1) Rext can be chosen so that a maximum LED current value between 1 mA and 20 mA can be programmed. Remark: LED current accuracy is proportional to the accuracy and temperature coefficient tolerance of Rext. When no external resistor is connected between the ISET pin and GND, the LED output is able to source 5 mA through a fully internal current source. It is automatically shut down when an external resistor is connected to ISET. Remark: The LED current accuracy is proportional to the tolerance and temperature coefficient of the resistor. Remark: To save power, the current source generator is only enabled when the LED needs to be turned on. 8.10 Short-circuit and thermal protection A short-circuit and thermal protection circuitry disables the LED output driver and the current generator when a short occurs or when a high temperature condition has been detected. The circuitry is active during normal mode operation (Programing, RUN ONCE, RUN or Bypass modes). When a fault condition is detected, the reference current circuitry (ISET) and the LED output stage (LEDOUT) are automatically shut down. This will cause LEDOUT to be OFF as long as the fault condition is present. The other analog blocks (oscillator, voltage reference) are kept enabled as long as the PCA9901 is in normal mode operation. The PCA9901 goes automatically to Power-down mode when it exits the programming, RUN ONCE, RUN or Bypass modes. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 11 of 27 NXP Semiconductors PCA9901 One wire single LED driver If the fault condition goes away during normal mode operation, the reference current circuitry and the LED output stage are again enabled, allowing the PCA9901 to resume control of the LED output stage (LEDOUT). A short-circuit condition is detected when the PCA9901's current consumption becomes higher than 50 mA. An overtemperature condition is detected when the temperature goes above 125 C. It goes away when the temperature goes 15 C below the overtemperature condition. 8.11 Shutdown mode Shutdown mode is the low power mode where the internal oscillator, band gap, current generator and LED driver are turned off to save power, and is the default mode at power-up. Shutdown mode is automatically entered after: * * * * * A RUN ONCE sequence has been executed A STOP command A TRAINING END command A RESET command A Time-out condition has been detected. When in Shutdown mode, setting CTRL HIGH immediately exits the Shutdown mode: the oscillator and the band gap are turned on and it takes up to 1.5 ms for the device to be up and running and decode the command issued by the host controller. 8.12 Reset Reset mode is achieved by sending a RESET command and causes all the registers to be reset to zeroes and the device to go to Shutdown mode. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 12 of 27 NXP Semiconductors PCA9901 One wire single LED driver 9. Application design-in information VBAT VDD CTRL VDD ILEDOUT LEDOUT HOST CONTROLLER PCA9901 GND ISET Rext(1) GND 002aac609 (1) Accuracy of the output current directly proportional to the accuracy of the external resistor. R ext = 1.23 x 400 ------------------------I LEDOUT Fig 10. Application diagram 10. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDD VI II IO Tstg Tamb VESD Parameter supply voltage input voltage input current output current storage temperature ambient temperature electrostatic discharge voltage operating HBM MM CDM VESD(LEDOUT) electrostatic discharge voltage on pin LEDOUT [1] Conditions CTRL pin ISET pin ISET LEDOUT ISET Min -0.3 -0.3 -0.3 -65 -40 -2000 -200 -500 [1] Max +6.0 VDD + 0.2 VDD + 0.2 125 50 125 +150 +85 +2000 +200 +500 +2000 Unit V V V A mA A C C V V V V HBM -2000 ESD rating on that specific pin may be higher. Will be updated if needed when device available and ESD test performed. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 13 of 27 NXP Semiconductors PCA9901 One wire single LED driver 11. Static characteristics Table 5. Static characteristics VDD = 2.7 V to 5.5 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol Supply VDD IDD supply voltage supply current VDD = 3.3 V; CTRL = GND; LEDOUT = 0 mA; excludes LED drive and current mirror currents maximum current before short detected; guaranteed by design LEDOUT enabled rising power supply when LED current dropped 10 % from the nominal current value ILEDOUT = 5 mA ILEDOUT = 10 mA ILEDOUT = 20 mA VLEDOUT ILEDOUT IO/IO voltage on pin LEDOUT current on pin LEDOUT with external resistor without external resistor relative output current variation symmetrical (peak-to-peak); must not offset average current setting current load regulation overtemperature and LED VF change from 1.2 V to VDD with external resistor overtemperature and LED VF change from 1.2 V to Vdo with external resistor overtemperature and LED VF change from 1.2 V to 3.1 V without external resistor CTRL pin VIL VIH IIH ILI Ci LOW-level input voltage HIGH-level input voltage HIGH-level input current input leakage current input capacitance VI = VSS or VDD 1.2 -1 0.4 1 5 V V A A pF -10 +10 % 1.2 1 40 75 5 30 50 110 3.1 20 5 mV mV mV V mA mA % 2.7 3.3 5.5 40 V A Parameter Conditions Min Typ Max Unit IDD(sd) Ith(det)sc IO/(IOxVI) VPOR LEDOUT pin Vdo shutdown mode supply current short-circuit detection threshold current line regulation power-on reset voltage dropout voltage - 0.3 50 1.8 0.75 70 2 2.0 A mA %/V V ILEDOUT/ILEDOUT relative current variation on pin LEDOUT -30 - +30 % -30 - +30 % PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 14 of 27 NXP Semiconductors PCA9901 One wire single LED driver Table 5. Static characteristics ...continued VDD = 2.7 V to 5.5 V; Tamb = -40 C to +85 C; unless otherwise specified. Symbol ISET pin VISET VISET/VISET IO/Iexp ILED/IISET voltage on pin ISET relative voltage variation on pin ISET output current variation to expected current ratio LED current to ISET current ratio shutdown temperature hysteresis of shutdown temperature ILEDOUT = 5 mA to 20 mA linearity of ILED / ISET function ILEDOUT = 5 mA to 20 mA -10 -2 1.23 400 +10 2 V % % Parameter Conditions Min Typ Max Unit Thermal shutdown Tsd Tsd(hys) guaranteed by design guaranteed by design 125 15 C C 12. Dynamic characteristics Table 6. Dynamic characteristics VDD = 2.7 V to 5.5 V; Tamb = -40 C to 85 C; unless otherwise specified. Symbol CTRL pin tWH(CTRL) tWL(CTRL) tdecod(cmd) tw(spike) LEDOUT pin tWH(LEDOUT) pulse width HIGH on pin LEDOUT tWL(LEDOUT) TLED Oscillator fosc/fosc relative oscillator frequency variation over temperature; guaranteed by design 5 % pulse width LOW on pin LEDOUT LED period variation minimum LED ON period minimum LED OFF period internal oscillator clock cycle [1] [2] Parameter pulse width HIGH on pin CTRL pulse width LOW on pin CTRL command decode time spike pulse width Conditions command pulse ON command pulse OFF Min 2 2 -200 Typ 1.5 25 1 20 - Max 50 75 1 % 1 % +200 Unit s s ms ns ms ms s [1] [2] LED ON-time resolution. LED OFF-time resolution. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 15 of 27 NXP Semiconductors PCA9901 One wire single LED driver 13. Tape and reel information 4.00 0.10 4.00 0.10 2.00 0.05 1.50 + 0.10 1.75 0.10 8.00 + 0.30 - 0.10 3.50 0.05 5 max. K0 B0 1.35 0.05 0.50 0.05 K0 A0 1.15 0.05 0.75 0.05 0.254 0.02 002aae764 Dimensions are in millimeter (mm). Fig 11. WL-CSP embossed carrier tape configuration PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 16 of 27 NXP Semiconductors PCA9901 One wire single LED driver 14. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 D E A X c y HE vMA Z 8 5 A2 pin 1 index A1 (A3) A Lp L 1 e bp 4 detail X wM 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.45 0.25 c 0.28 0.15 D(1) 3.1 2.9 E(2) 3.1 2.9 e 0.65 HE 5.1 4.7 L 0.94 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z(1) 0.70 0.35 6 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT505-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-04-09 03-02-18 Fig 12. Package outline SOT505-1 (TSSOP8) PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 17 of 27 NXP Semiconductors PCA9901 One wire single LED driver XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm SOT996-2 D B A E A A1 detail X terminal 1 index area e1 L1 1 e b 4 v w M M CAB C C y1 C y L2 L 8 5 X 0 1 scale 2 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.35 0.15 D 2.1 1.9 E 3.1 2.9 e 0.5 e1 1.5 L 0.5 0.3 L1 0.15 0.05 L2 0.6 0.4 v 0.1 w 0.05 y 0.05 y1 0.1 OUTLINE VERSION SOT996-2 REFERENCES IEC --JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 13. Package outline SOT996-2 (XSON8U) PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 18 of 27 NXP Semiconductors PCA9901 One wire single LED driver WLCSP6: wafer level chip-size package; 6 bumps; 1.0 x 1.2 x 0.6 mm PCA9901UK D B A ball A1 index area A2 E A A1 detail X e 1/2 e b v w CAB C y1 C C y C B e1 A 1 2 X 0 0.5 scale 1 mm Dimensions Unit mm A A1 A2 b D 1.1 1.0 0.9 E 1.25 1.20 1.15 e 0.4 e1 0.8 v w y max 0.63 0.23 0.40 0.29 nom 0.58 0.20 0.38 0.26 min 0.53 0.17 0.36 0.23 0.01 0.04 0.02 PCA9901uk_po Outline version PCA9901UK References IEC JEDEC JEITA European projection Issue date 07-08-30 09-11-05 Fig 14. Package outline PCA9901UK (WLCSP6) PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 19 of 27 NXP Semiconductors PCA9901 One wire single LED driver 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description". 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: * Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: * * * * * * Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 15.3 Wave soldering Key characteristics in wave soldering are: * Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave * Solder bath specifications, including temperature and impurities PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 20 of 27 NXP Semiconductors PCA9901 One wire single LED driver 15.4 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 15) than a SnPb process, thus reducing the process window * Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 7 and 8 Table 7. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 8. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2 000 260 250 245 > 2 000 260 245 245 350 220 220 Package thickness (mm) Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 15. PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 21 of 27 NXP Semiconductors PCA9901 One wire single LED driver temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 15. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description". 16. Soldering of WLCSP packages 16.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note AN10439 "Wafer Level Chip Scale Package" and in application note AN10365 "Surface mount reflow soldering description". Wave soldering is not suitable for this package. All NXP WLCSP packages are lead-free. 16.2 Board mounting Board mounting of a WLCSP requires several steps: 1. Solder paste printing on the PCB 2. Component placement with a pick and place machine 3. The reflow soldering itself 16.3 Reflow soldering Key characteristics in reflow soldering are: * Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 16) than a PbSn process, thus reducing the process window PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 22 of 27 NXP Semiconductors PCA9901 One wire single LED driver * Solder paste printing issues, such as smearing, release, and adjusting the process window for a mix of large and small components on one board * Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature), and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9. Table 9. Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2 000 260 250 245 > 2 000 260 245 245 Package thickness (mm) Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 16. temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 16. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 "Surface mount reflow soldering description". 16.3.1 Stand off The stand off between the substrate and the chip is determined by: * The amount of printed solder on the substrate * The size of the solder land on the substrate PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 23 of 27 NXP Semiconductors PCA9901 One wire single LED driver * The bump height on the chip The higher the stand off, the better the stresses are released due to TEC (Thermal Expansion Coefficient) differences between substrate and chip. 16.3.2 Quality of solder joint A flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. The surface of the joint should be smooth and the shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. No failures have been found to be related to these voids. Solder joint inspection after reflow can be done with X-ray to monitor defects such as bridging, open circuits and voids. 16.3.3 Rework In general, rework is not recommended. By rework we mean the process of removing the chip from the substrate and replacing it with a new chip. If a chip is removed from the substrate, most solder balls of the chip will be damaged. In that case it is recommended not to re-use the chip again. Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. Removing the device must be done using plastic tweezers, because metal tweezers can damage the silicon. The surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill removed. When a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. Apply flux on the bumps at the chip side as well as on the solder pads on the substrate. Place and align the new chip while viewing with a microscope. To reflow the solder, use the solder profile shown in application note AN10365 "Surface mount reflow soldering description". 16.3.4 Cleaning Cleaning can be done after reflow soldering. 17. Abbreviations Table 10. Acronym CDM ESD GPRS GSM HBM LED MM PWB Abbreviations Description Charged Device Model ElectroStatic Discharge Global Packet Radio System Global System for Mobile communications Human Body Model Light Emitting Diode Machine Model Printed Wiring Board PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 24 of 27 NXP Semiconductors PCA9901 One wire single LED driver 18. Revision history Table 11. Revision history Release date 20091203 Data sheet status Product data sheet Change notice Supersedes Document ID PCA9901_1 PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 25 of 27 NXP Semiconductors PCA9901 One wire single LED driver 19. Legal information 19.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 19.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PCA9901_1 (c) NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 -- 3 December 2009 26 of 27 NXP Semiconductors PCA9901 One wire single LED driver 21. Contents 1 2 3 4 4.1 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 8.2.6 8.3 8.4 8.5 8.6 8.7 8.8 8.8.1 8.8.2 8.8.3 8.8.4 8.9 8.10 8.11 8.12 9 10 11 12 13 14 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Digital interface overview - CTRL pin . . . . . . . . 5 Command descriptions . . . . . . . . . . . . . . . . . . . 6 TRAINING START command . . . . . . . . . . . . . . 6 TRAINING END command . . . . . . . . . . . . . . . . 6 RUN ONCE command . . . . . . . . . . . . . . . . . . . 6 RUN command . . . . . . . . . . . . . . . . . . . . . . . . . 6 STOP command . . . . . . . . . . . . . . . . . . . . . . . . 6 RESET command . . . . . . . . . . . . . . . . . . . . . . . 7 State machine . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Lighting training sequence . . . . . . . . . . . . . . . . 8 TRAINING START and TRAINING END commands waveforms . . . . . . . . . . . . . . . . . . . 9 RUN ONCE, RUN, STOP and RESET commands waveforms . . . . . . . . . . . . . . . . . . . 9 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Time-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 CTRL LOW too long after receiving a TRAINING START command . . . . . . . . . . . . . 10 CTRL HIGH too long during the training sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 CTRL LOW too long during the training sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 `Synchronization' signal not generated after RUN ONCE command . . . . . . . . . . . . . . 11 Current source generation . . . . . . . . . . . . . . . 11 Short-circuit and thermal protection . . . . . . . . 11 Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . 12 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application design-in information . . . . . . . . . 13 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13 Static characteristics. . . . . . . . . . . . . . . . . . . . 14 Dynamic characteristics . . . . . . . . . . . . . . . . . 15 Tape and reel information . . . . . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 15 15.1 15.2 15.3 15.4 16 16.1 16.2 16.3 16.3.1 16.3.2 16.3.3 16.3.4 17 18 19 19.1 19.2 19.3 19.4 20 21 Soldering of SMD packages . . . . . . . . . . . . . . Introduction to soldering. . . . . . . . . . . . . . . . . Wave and reflow soldering. . . . . . . . . . . . . . . Wave soldering . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Soldering of WLCSP packages . . . . . . . . . . . Introduction to soldering WLCSP packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Board mounting . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering . . . . . . . . . . . . . . . . . . . . . . Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Quality of solder joint . . . . . . . . . . . . . . . . . . . Rework. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cleaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 20 20 20 21 22 22 22 22 23 24 24 24 24 25 26 26 26 26 26 26 27 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 December 2009 Document identifier: PCA9901_1 |
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